residual stress.

利用緩衝層結構改善薄膜沉積於壓克力基板附著度之研究 = = A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure / by: (書目-語言資料,印刷品)

在可撓式塑膠基板上沉積透明導電薄膜之機械撓曲特性研究 = = Flexibility Properties of A Transparent Conductive Film Deposited on The Plastic Substrate / by: (書目-語言資料,印刷品)

以分子動力學模擬鈷團簇原子沈積於矽基板之研究 = = Molecular Dynamics Simulation of Co Cluster Deposition on Si Substrate / by: (書目-語言資料,印刷品)

優化介層設計氮化鋁鈦鉻硬質薄膜之抗衝擊疲勞與機械性能分析 = = Impact Fatigue and Mechanical Properties of AlTiCrN Hard Coatings with Optimal Design of Interlayers / by: (書目-語言資料,印刷品)

壓克力.

organic silicon.

PECVD.

AlTiCrN.

hard coating.

mechanical.

buffer layer.

電漿增強化學氣相沉積系統.

射頻磁控共濺鍍系統.

polymethyl methacrylate(PMMA).

緩衝層.

殘留應力.

氧化銦錫-氧化鋅.

RF magnetron co-sputtering system.

機械性質.

Indium Tin Oxide-doped Zinc Oxide.

分子動力學.

氧化銦錫.

團簇沈積.

cluster deposition.

附著度.

有機矽基.

Tersoff多體勢能.

Indium Tin Oxide.

Tight Binding & Tersoff potential function.

adhesion.

Aluminum-doped Zinc Oxide.

residual stress.

鋁-氧化鋅.

molecular dynamics simulation.

bending reliability.

Tight Binding多體勢能.

撓曲可靠度.

硬質薄膜.