Languages
張韋捷
Overview
Works: | 0 works in 1 publications in 1 languages |
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Titles
雷射輔助結合製程之覆晶封裝有限元素法與最佳化參數設計 = = Finite Element Method and Optimal Parameter Design for Laser-Assisted Bonding Process in Flip Chip Package /
by:
張韋捷
(Language materials, printed)