Languages
莊顏聞
Overview
Works: | 2 works in 1 publications in 1 languages |
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Titles
應用矽副載具於高功率發光二極體覆晶封裝技術之研究 = Study of flip chip packaging technique on high power LEDs by adopting silicon submount
by:
莊顏聞; Yan-Wun Jhuang; Wen-Ray Chen; 陳文瑞
(Language materials, printed)