脫層.
Overview
Works: | 3 works in 3 publications in 3 languages |
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Titles
電子封裝界面強度量測與濕-熱耦合脫層損傷分析 = = Electronic Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation /
by:
(Language materials, printed)
電子封裝界面結合強度量測與脫層損傷分析 = = Electronic Packaging Interfacial Strength Measurement and Delamination Investigation /
by:
(Language materials, printed)
量產發光二極體封裝製程技術之改善 = = Improvement of the packaging process and technique for the LED mass production /
by:
(Language materials, printed)