thermal evaporation.
Overview
Works: | 3 works in 2 publications in 2 languages |
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Titles
以鋁鍺錫暫態液相鍵合應用於低溫覆晶封裝之研究 = = The Study of The Low Temperature Flip-Chip Package by Applying AlGeSn-Based Transient Liquid Phase Bonding Technique /
by:
(Language materials, printed)
應用鋁鍺錫暫態液相鍵結技術於晶片接合面之研究 = = Study of The Die-Attached Joint by Using AlGeSn TLP Bonded Technology /
by:
(Language materials, printed)