Languages
Kim, Choong-Un.
Overview
Works: | 1 works in 1 publications in 1 languages |
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Titles
Electromigration in thin films and electronic devices = materials and reliability /
by:
Kim, Choong-Un.
(Language materials, printed)
Fundamentals of Lead-Free Solder Interconnect Technology = From Microstructures to Reliability /
by:
Bieler, Thomas R.; Kim, Choong-Un.; Ma, Hongtao.; SpringerLink (Online service); Lee, Tae-Kyu.
(Language materials, printed)
, [http://id.loc.gov/vocabulary/relators/aut]
Subjects