劉漢誠

Overview

Works:	1 works in 2 publications in 1 languages

Titles

芯片尺寸封裝 : 設計、材料、工藝、可靠性及應用 by: 劉漢誠; 賈松良; 李世瑋 (Language materials, printed) , [著]

球腳格狀陣列裝封技術 = Ball Grid Array Technology by: 劉漢誠 (Language materials, printed) , [著]

Subjects

電子學