方昭訓

Overview

Works:	0 works in 20 publications in 1 languages

Titles

OCC熱模連續鑄造法研究與應用 = Research and Application of the OCC Heated Mold Continuous Casting Method by: Jau-Shiung Fang; 陳浚科; Chun-Ke Chen; 方昭訓 (Language materials, printed)

共濺鍍沉積製備鈷-鈦-氧顆粒合金薄膜磁阻特性 = Evaluation of magnetoresistance characteristic of co-sputtered Co-Ti-O granular alloy thin films by: 鄭文凱; Jau-Shiung Fang; 方昭訓 (Language materials, printed) , [指導]

以金屬靶反應性磁控共濺鍍製備氧化銦鋅透明導電薄膜之研究 = Preparation and Properties of the Indium Zinc Oxide by Reactive Magnetron Co-sputtering using Indium and Zinc Metallic Targets by: Hui-Chin Chen; 方昭訓; 陳慧津; 國立虎尾科技大學; Jau-Shiung Fang (Language materials, printed)

藍寶石基板之乾式蝕刻及其應用於氮化鎵發光二極體之研究 = Dry etching of sapphire substrates and its application for GaN-based light-emitting diodes by: 武東星; Dong-Sing Wuu; 方昭訓; 施文忠; Jau-Shing Fang (Language materials, printed) , [指導]

RFID應用於局限空間e化管理之研究 = Applications of rfid in confined space management system by: Eric-Wang; Jau-Shiung Fang; Hung-Wei Chen; 王鵬堯; 方昭訓; 陳泓瑋 (Language materials, printed)

自我鈍化型銅鋁合金薄膜之抗氧化性及電性研究 = Improvement of Against Oxidation and Electrical Properties of Passivated Cu(Al) Thin Film by: 方昭訓; 田宏吉; Jau-Shiung Fang; Hung-Chi Tien (Language materials, printed)

銀鑭合金薄膜之抗氧化與抗硫化探討 = Study on against oxidation and sulfidation of ag(la) thin film by: 方昭訓; Yaun-Ting Chan; 詹媛婷; Jau-Shiung Fang (Language materials, printed)

雙層超薄Ru/Ta-Si-C擴散阻障層與銅連導線製程特性探討 = Properties of Ultrathin Ru/TaSiC Bi-Layer Diffusion Barrier for Cu Interconnects by: 方昭訓; 黃孟碩; Meng-Shuo Huang; Jau-Shiung Fang (Language materials, printed)

Cu(CoN)與CoN薄膜應用於銅製程之特性研究 = Characteristics of Cu(CoN) Film and CoN Film on Copper Interconnection by: Jau-Shiung Fang; 方昭訓; 王梓育; Tzu-Yu Wang (Language materials, printed)

低電阻率自我鈍化型銅銦合金薄膜之固溶特性及電性研究 = Structural and passivate behaviors of Cu(In) thin film by: 謝馨儀; 方昭訓; Jau-Shiung Fang (Language materials, printed) , [指導]

Subjects

擴散阻障層低電阻率 reactive magnetron co-sputter Cu(HEA)合金薄膜 thermal stability magnetron sputtering 熱模連續鑄造 sulfidation Ta-Si-C 薄膜電晶體氧化銦共濺鍍法 Cu electroplating 阻障層反應性磁控濺鍍 Cu seed layer 化學鍍浴沉積法 chemical bath deposition Copper metallization Cu(Hf) alloy films zinc oxide self-passivated 附著性銅晶種層 Cu(Al) alloy thin film adhesion Cu(HEA) alloy thin film 鉭 high entropy alloy copper metallization amorphous plasma surface treatment Cu(In) alloy thin film Ta-Co-N films 磁控濺鍍 Ta-Si-C(O)x copper 透明導電薄膜硫化銅製程 tunneling magnetoresistance 合金薄膜 Thin-film transistor indium zinc oxide 磁控共濺鍍釕 self-passivation substrate bias Ta-Si-C 薄膜氧化鋅 magnetoresistance cobalt nitrides HfN Ohno Continuous Casting 碳 TaSi2 勞工顆粒合金薄膜銅 Ta-B sputtering deposition Ru-Ta-B TaNi amorphous hin film Ag(La) alloy thin film 自我鈍化銅鉿合金薄膜電鍍銅 manganese 無線射頻辨識技術 Ru-B 承攬商 low resistivity 銀鑭合金薄膜 transparent conducting oxide 共濺鍍稀磁半導體 co-sputtering Magnetron Sputter 氮化鈷錳非晶質薄膜鉭矽化物穿隧磁阻 heated mold 基板偏壓銅銦合金薄膜非晶質 Cu(CoN) alloy thin film Carbon labor 銅鋁合金薄膜高熵合金銅鈷氮合金薄膜電漿表面改質銅金屬化製程局限空間 amorphous films Cu(Hf) alloy thin film 加熱鑄模 diluted magnetic semiconductor 氮化鉿 RFID contract worker 熱穩定性非晶質TaNi薄膜 Cu metallization confined space 濺鍍擴散阻礙層 co-sputter diffusion barrier