Languages
劉孟宗
Overview
| Works: | 0 works in 1 publications in 1 languages | |
|---|---|---|
Titles
高導電性錫球與膠材對WLCSP技術之最佳化設計 = Optimal Design of a High Conductivity Solder Ball and Underfill Technology for Wafer Level Chip Scale Package
by:
莊為群; Wei-Ching Chuang; Meng-Tzung Liu; 劉孟宗
(Language materials, printed)
Subjects