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林定皓.
Overview
Works:
3 works in 10 publications in 1 languages
Titles
高密度印刷電路板技術 = = HDI boards technology introduction /
by: 林定皓.
(Language materials, printed)
電子構裝技術概述 = = Electronic packaging technology introduction /
by: 林定皓.
(Language materials, printed)
印刷電路板槪論.. 養成篇
by: 凌網科技股份有限公司; 林定皓.
(Language materials, printed)
2011軟性電路板技術簡介= = FPC technology./
by: 林定皓.
(Language materials, printed)
印刷電路板電子組裝技術概述 = = PCB assembly technology introduction /
by: 林定皓.
(Language materials, printed)
高密度印刷電路板技術 = = HDI technology introduction /
by: 林定皓.
(Language materials, printed)
PCB製程與問題改善 = = PCB trouble shooting guide /
by: 林定皓.
(Language materials, printed)
電路板技術實務問答 = = PCB Q & A /
by: 林定皓.
(Language materials, printed)
PCB製程與問題改善 = = PCB trouble shooting guide /
by: 林定皓.
(Language materials, printed)
製程細說 : = 孔壁金屬化 = PCB metallization technology /
by: 林定皓.; TPCA
(Language materials, printed)
Subjects
印刷電路
半導體.
問題集.
印刷電路.
電子工程.
積體電路.
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