| Record Type: |
Language materials, printed
: Monograph/item
|
| Title/Author: |
電子構裝技術概述 =/ 林定皓編著. |
| Reminder of title: |
Electronic packaging technology introduction / |
| remainder title: |
Electronic packaging technology introduction |
| Author: |
林定皓. |
| Published: |
桃園縣大園鄉 :臺灣電路板協會, : [民99]., |
| Description: |
412面 :部份彩圖, 表 ; : 26公分.; |
| Notes: |
附錄 : 1, 詞彙整理 ; 2, 典型構裝名稱外觀對照表. |
| Subject: |
半導體. - |
| ISBN: |
9789868555334 (平裝) : |