Liu, Yong.
概要
| 作品: | 1 作品在 3 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Exploration of Novel Intelligent Optimization Algorithms = 12th International Symposium, ISICA 2021, Guangzhou, China, November 20–21, 2021, Revised Selected Papers /
by:
Wang, Wenxiang.; Li, Kangshun.; Liu, Yong.; SpringerLink (Online service)
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Current Geotechnical Engineering Aspects of Civil Infrastructures = Proceedings of the 5th GeoChina International Conference 2018 – Civil Infrastructures Confronting Severe Weathers and Climate Changes: From Failure to Sustainability, held on July 23 to 25, 2018 in HangZhou, China /
by:
Liu, Yong.; Lee, Jeffrey.; Weng, Meng-Chia.; SpringerLink (Online service)
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Value in Business = A Holistic, Systems-based Approach to Creating and Achieving Value /
by:
Forrest, Jeffrey Yi-Lin.; SpringerLink (Online service); Liu, Yong.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Advances in Innovative Geotechnical Engineering = Proceedings of the 6th GeoChina International Conference on Civil & Transportation Infrastructures: From Engineering to Smart & Green Life Cycle Solutions -- Nanchang, China, 2021 /
by:
Liu, Yong.; Cuomo, Sabatino.; SpringerLink (Online service); Yang, Junsheng.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Computational Intelligence and Intelligent Systems = 7th International Symposium, ISICA 2015, Guangzhou, China, November 21-22, 2015, Revised Selected Papers /
by:
Li, Jin.; SpringerLink (Online service); Li, Kangshun.; Liu, Yong.; Castiglione, Aniello.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Computational Intelligence and Intelligent Systems = 10th International Symposium, ISICA 2018, Jiujiang, China, October 13–14, 2018, Revised Selected Papers /
by:
Deng, Changshou.; Liu, Yong.; Wu, Zhijian.; Peng, Hu.; SpringerLink (Online service)
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Passive and Active Measurement = 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings /
by:
SpringerLink (Online service); Liu, Yong.; Mirkovic, Jelena.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Computational Intelligence and Intelligent Systems = 9th International Symposium, ISICA 2017, Guangzhou, China, November 18–19, 2017, Revised Selected Papers, Part I /
by:
Li, Wei.; SpringerLink (Online service); Li, Kangshun.; Chen, Zhangxing.; Liu, Yong.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
3D cinematic aesthetics and storytelling
by:
SpringerLink (Online service); Liu, Yong.
(書目-語言資料,印刷品)
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery = Volume 2 /
by:
Liu, Yong.; Zhao, Liang.; SpringerLink (Online service); Wang, Lipo.; Yu, Zhengtao.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Artificial Intelligence Algorithms and Applications = 11th International Symposium, ISICA 2019, Guangzhou, China, November 16–17, 2019, Revised Selected Papers /
by:
Li, Kangshun.; Liu, Yong.; Wang, Hui.; SpringerLink (Online service); Li, Wei.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Computational Intelligence and Intelligent Systems = 9th International Symposium, ISICA 2017, Guangzhou, China, November 18–19, 2017, Revised Selected Papers, Part II /
by:
Li, Kangshun.; Chen, Zhangxing.; Liu, Yong.; SpringerLink (Online service); Li, Wei.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Wafer-level chip-scale packaging = analog and power semiconductor applications /
by:
SpringerLink (Online service); Qu, Shichun.; Liu, Yong.
(書目-語言資料,印刷品)
Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery = Volume 1 /
by:
Liu, Yong.; Zhao, Liang.; SpringerLink (Online service); Wang, Lipo.; Yu, Zhengtao.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/edt]
Wafer-Level Chip-Scale Packaging = Analog and Power Semiconductor Applications /
by:
SpringerLink (Online service); Qu, Shichun.; Liu, Yong.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
3D Cinematic Aesthetics and Storytelling
by:
Liu, Yong.; SpringerLink (Online service)
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Power electronic packaging = design, assembly process, reliability and modeling /
by:
Liu, Yong.; SpringerLink (Online service)
(書目-語言資料,印刷品)
更多
較少的
主題
Knowledge representation (Information theory) .
Image Processing and Computer Vision.
Artificial intelligence.
Computer Communication Networks.
Electronic circuits.
Systems Theory, Control .
Foundations.
Algorithms.
Chip scale packaging.
Computer and Information Systems Applications.
Application software.
Film/TV Technology.
Business Strategy and Leadership.
Digital/New Media.
Solid State Physics.
Motion pictures
Engineering geology.
Leadership.
Computers.
System theory.
Electronic packaging.
Hydraulics.
Microelectronics.
Geoengineering, Foundations, Hydraulics.
Algorithm Analysis and Problem Complexity.
Knowledge based Systems.
Computer networks .
American Cinema and TV.
System Performance and Evaluation.
Information Systems Applications (incl. Internet).
Engineering Thermodynamics, Heat and Mass Transfer.
Mathematics of Computing.
Computer simulation.
Special purpose computers.
Computer vision.
Computer communication systems.
Heat transfer.
Power electronics.
Motion pictures.
Special Purpose and Application-Based Systems.
Strategic planning.
Computer security.
Computer Imaging, Vision, Pattern Recognition and Graphics.
Electronics and Microelectronics, Instrumentation.
Motion pictures—United States.
3-D films
Computer organization.
Computer science—Mathematics.
Computer engineering.
Systems and Data Security.
Storytelling in mass media.
Electronics.
Computer Systems Organization and Communication Networks.
Engineering—Geology.
Industrial organization.
Cinematography.
Artificial Intelligence.
American Cinema.
Computational Intelligence.
Engineering.
Spectroscopy and Microscopy.
Control theory.
Geotechnical engineering.
Image processing—Digital techniques.
Digital media.
Organization.
Thermodynamics.
Circuits and Systems.
Mass transfer.
Heat engineering.
Computational intelligence.
Computer Engineering and Networks.
Information Systems and Communication Service.
Cultural and Media Studies.
Data mining.
Simulation and Modeling.
Power Electronics, Electrical Machines and Networks.
Computer system failures.
Optical data processing.
Geotechnical Engineering & Applied Earth Sciences.
Data Mining and Knowledge Discovery.