語系
Lee, Ning-Cheng.
概要
| 作品: | 1 作品在 1 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Assembly and Reliability of Lead-Free Solder Joints
by:
SpringerLink (Online service); Lau, John H.; Lee, Ning-Cheng.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Reflow soldering processes = SMT, BGA, CSP and flip chip technologies /
by:
Lee, Ning-Cheng.
(書目-語言資料,印刷品)