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Assembly and Reliability of Lead-Free Solder Joints

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Assembly and Reliability of Lead-Free Solder Joints/ by John H. Lau, Ning-Cheng Lee.
作者:	Lau, John H.
其他作者:	Lee, Ning-Cheng.
面頁冊數:	XXI, 527 p. 598 illus., 347 illus. in color.online resource. :
Contained By:	Springer Nature eBook
標題:	Circuits and Systems. -
電子資源:	https://doi.org/10.1007/978-981-15-3920-6
ISBN:	9789811539206

Assembly and Reliability of Lead-Free Solder Joints
Lau, John H.

Assembly and Reliability of Lead-Free Solder Joints[electronic resource] /by John H. Lau, Ning-Cheng Lee. - 1st ed. 2020. - XXI, 527 p. 598 illus., 347 illus. in color.online resource.

Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

ISBN: 9789811539206

Standard No.: 10.1007/978-981-15-3920-6doiSubjects--Topical Terms:

670901
Circuits and Systems.

LC Class. No.: TK7800-8360

Dewey Class. No.: 621.381

Assembly and Reliability of Lead-Free Solder Joints
LDR:02618nam a22004095i 4500 001 1028344
003 DE-He213
005 20200703121043.0
007 cr nn 008mamaa
008 210318s2020 si | s |||| 0|eng d
020 $a 9789811539206 $9 978-981-15-3920-6
024 7 $a 10.1007/978-981-15-3920-6 $2 doi
035 $a 978-981-15-3920-6
050 4 $a TK7800-8360
050 4 $a TK7874-7874.9
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
100 1 $a Lau, John H. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 791741
245 1 0 $a Assembly and Reliability of Lead-Free Solder Joints $h [electronic resource] / $c by John H. Lau, Ning-Cheng Lee.
250 $a 1st ed. 2020.
264 1 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2020.
300 $a XXI, 527 p. 598 illus., 347 illus. in color. $b online resource.
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
347 $a text file $b PDF $2 rda
505 0 $a Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
520 $a This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
650 2 4 $a Circuits and Systems. $3 670901
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 670219
650 0 $a Electronic circuits. $3 563332
650 0 $a Microelectronics. $3 554956
650 0 $a Electronics. $3 596389
700 1 $a Lee, Ning-Cheng. $4 aut $4 http://id.loc.gov/vocabulary/relators/aut $3 907876
710 2 $a SpringerLink (Online service) $3 593884
773 0 $t Springer Nature eBook
776 0 8 $i Printed edition: $z 9789811539190
776 0 8 $i Printed edition: $z 9789811539213
776 0 8 $i Printed edition: $z 9789811539220
856 4 0 $u https://doi.org/10.1007/978-981-15-3920-6
912 $a ZDB-2-ENG
912 $a ZDB-2-SXE
950 $a Engineering (SpringerNature-11647)
950 $a Engineering (R0) (SpringerNature-43712)