Lau, John H.
概要
| 作品: | 39 作品在 3 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Fan-Out Wafer-Level Packaging
by:
Lau, John H.; SpringerLink (Online service)
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Assembly and Reliability of Lead-Free Solder Joints
by:
Lau, John H.; SpringerLink (Online service); Lee, Ning-Cheng.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Semiconductor Advanced Packaging
by:
SpringerLink (Online service); Lau, John H.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
Heterogeneous Integrations
by:
SpringerLink (Online service); Lau, John H.
(書目-語言資料,印刷品)
, [http://id.loc.gov/vocabulary/relators/aut]
主題
Nanotechnology and Microengineering.
Electronics and Microelectronics, Instrumentation.
Optical materials.
Electronic circuits.
Electronics.
Chip scale packaging.
Electronic Circuits and Devices.
Semiconductors.
Microelectronic packaging.
Engineering.
Production engineering.
Industrial engineering.
Microelectronics.
Circuits and Systems.
Nanotechnology.
Optical and Electronic Materials.
Three-dimensional integrated circuits.
Industrial and Production Engineering.
Electronic materials.
Microelectromechanical systems.