Lau, John H.

Overview

Works:	41 works in 3 publications in 1 languages

Titles

Advanced MEMS packaging by: Lau, John H. (Language materials, printed)

Advanced MEMS packaging / by: Lau, John H. (Language materials, printed)

Fan-Out Wafer-Level Packaging by: Lau, John H.; SpringerLink (Online service) (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Assembly and Reliability of Lead-Free Solder Joints by: Lau, John H.; SpringerLink (Online service); Lee, Ning-Cheng. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

3D IC integration and packaging / by: Lau, John H. (Language materials, printed)

Semiconductor Advanced Packaging by: SpringerLink (Online service); Lau, John H. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Heterogeneous Integrations by: SpringerLink (Online service); Lau, John H. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Fan-out wafer-level packaging by: SpringerLink (Online service); Lau, John H. (Language materials, printed)

Subjects

Nanotechnology and Microengineering. Electronics and Microelectronics, Instrumentation. Industrial engineering. Microelectronics. Optical materials. Circuits and Systems. Optical and Electronic Materials. Semiconductors. Microelectronic packaging. Three-dimensional integrated circuits. Engineering. Electronic circuits. Electronics. Production engineering. Industrial and Production Engineering. Electronic materials. Microelectromechanical systems. Nanotechnology. Chip scale packaging. Electronic Circuits and Devices.