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先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliabilit...

丁柏睿

先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	先進扇出型封裝於落摔衝擊條件下之可靠度分析 =/ 丁柏睿.
Reminder of title:	Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions /
remainder title:	Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions.
Author:	丁柏睿
Published:	雲林縣 :國立虎尾科技大學 , : 民114.07.,
Description:	[11], 62面 :圖, 表 ; : 30公分.;
Notes:	指導教授: 吳瑋特, 施孟鎧.
Subject:	扇出型封裝. -
Online resource:	電子資源

先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions /
丁柏睿

先進扇出型封裝於落摔衝擊條件下之可靠度分析 =Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions /Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions.丁柏睿. - 初版. - 雲林縣 :國立虎尾科技大學 ,民114.07. - [11], 62面 :圖, 表 ;30公分.

指導教授: 吳瑋特, 施孟鎧.

碩士論文--國立虎尾科技大學機械與電腦輔助工程系碩士班.

含參考書目.

(平裝).Subjects--Topical Terms:

1416164
扇出型封裝.

先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions /
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650 # 4 $a 落摔衝擊測試. $3 1494460
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650 # 4 $a Drop Impact Test. $3 1494462
650 # 4 $a Finite Element Method. $3 995070
650 # 4 $a Reliability Analysis. $3 1450795
650 # 4 $a Optimization Analysis. $3 1494463
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