扇出型封裝.

先進扇出型封裝之再分布層界面強度量測與濕-熱耦合脫層損傷分析 = = Advanced Fan-Out Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (書目-語言資料,印刷品)

先進扇出型封裝之銅柱凸塊可靠度分析 = = Reliability Analysis of Copper Pillar Bumps for Advanced Fan-Out Packaging / by: (書目-語言資料,印刷品)

Strain Energy Release Rate.

Finite Element Analysis.

Hygro-thermal Coupling.

有限元素分析.

濕-熱耦合.

雙懸臂樑.

Fan-Out.

Thermal Cycling Test.

Delamination.

反應曲面法.

Cu Pillar Bump.

Response Surface Methodology.

Double Cantilever Beam.

虛擬裂紋閉合技術.

應變能釋放率.

Virtual crack closure technique method.

銅柱凸塊.

溫度循環測試.

Fan-Out Package.

脫層.

扇出型封裝.