Hygro-thermal Coupling.
Overview
| Works: | 2 works in 2 publications in 2 languages | |
|---|---|---|
Titles
電子封裝界面強度量測與濕-熱耦合脫層損傷分析 = = Electronic Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation /
by:
(Language materials, printed)