扇出型封裝.

先進扇出型封裝之銅柱凸塊可靠度分析 = = Reliability Analysis of Copper Pillar Bumps for Advanced Fan-Out Packaging / by: (Language materials, printed)

先進扇出型封裝之再分布層界面強度量測與濕-熱耦合脫層損傷分析 = = Advanced Fan-Out Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation / by: (Language materials, printed)

先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions / by: (Language materials, printed)

Reliability Analysis.

Strain Energy Release Rate.

Optimization Analysis.

Finite Element Analysis.

Fan-Out Packaging.

雙懸臂樑.

Delamination.

Response Surface Methodology.

Cu Pillar Bump.

Drop Impact Test.

Fan-Out Package.

銅柱凸塊.

可靠度分析.

Finite Element Method.

脫層.

扇出型封裝.

Hygro-thermal Coupling.

有限元素分析.

濕-熱耦合.

優化分析.

Fan-Out.

有限元素法.

Thermal Cycling Test.

反應曲面法.

Double Cantilever Beam.

Virtual crack closure technique method.

應變能釋放率.

虛擬裂紋閉合技術.

落摔衝擊測試.

溫度循環測試.