扇出型封裝.
Overview
| Works: | 2 works in 2 publications in 2 languages | |
|---|---|---|
Titles
先進扇出型封裝之再分布層界面強度量測與濕-熱耦合脫層損傷分析 = = Advanced Fan-Out Packaging Interface Strength Measurement and Hygro-thermal Coupling Delamination Investigation /
by:
(Language materials, printed)
先進扇出型封裝之銅柱凸塊可靠度分析 = = Reliability Analysis of Copper Pillar Bumps for Advanced Fan-Out Packaging /
by:
(Language materials, printed)
Subjects