Integrated circuits - Wafer-scale integration.

Ultra-thin chip technology and applications by: (Language materials, printed)

Wafer level 3-d ics process technology by: (Language materials, printed)

Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : = high performance compute and system-in-package / by: (Language materials, printed)

Electronics and Microelectronics, Instrumentation.

Integrated circuits

Microelectronics.

Computer-Aided Engineering (CAD, CAE) and Design.

Circuits and Systems.

Surfaces and Interfaces, Thin Films.

Optical and Electronic Materials.

Engineering.

Engineering, general.

Chip scale packaging.