Reliability Analysis.

高可靠度3U立方衛星之電源系統研製 = = Design and Implementation of High Reliability Electrical Power System for 3U Cubesat / by: (書目-語言資料,印刷品)

JEDEC落摔與類系統級落摔測試對錫球可靠度之分析 = = Solder Joint Reliability Comparison under JEDEC Drop and System-like Drop Test Conditions / by: (書目-語言資料,印刷品)

先進扇出型封裝於落摔衝擊條件下之可靠度分析 = = Reliability Assessment of Advanced Fan-Out Packages Under Drop Impact Conditions / by: (書目-語言資料,印刷品)

基於近似數值模擬之電子封裝銲點落摔可靠度與設計優化研究 = = Reliability and Design Optimization of Solder Joints in Electronic Packaging under Drop Impact Based on Approximate Numerical Simulation / by: (書目-語言資料,印刷品)

Reliability Analysis.

氮化鎵.

Optimization Analysis.

TFBGA.

Nodal Displacement-Driven Method.

Gallium Nitride.

近似模型.

Fan-Out Packaging.

立方衛星.

Drop Impact Test.

Approximate mode.

Optimization.

Finite Element Method.

可靠度分析.

薄型精密球柵陣列封裝.

扇出型封裝.

Perturb and Observe.

落摔測試.

Drop Test.

優化分析.

擾動觀察法.

有限元素法.

節點位移驅動.

Cubesat.

落摔衝擊測試.