5 nm之Ru-(Ta)-B擴散阻障層與銅製程特性 = 5 nm of ...
Wen-Jing Li

 

  • 5 nm之Ru-(Ta)-B擴散阻障層與銅製程特性 = 5 nm of Ru-(Ta)-B diffusion barrier layer and copper processing characteristics
  • Record Type: Language materials, printed : monographic
    Paralel Title: 5 nm of Ru-(Ta)-B diffusion barrier layer and copper processing characteristics
    Author: 李文菁,
    Secondary Intellectual Responsibility: 方昭訓,
    Place of Publication: 雲林縣
    Published: 國立虎尾科技大學;
    Year of Publication: 民99[2010]
    Edition: 初版
    Description: 136面圖 : 30公分;
    Subject:
    Subject:
    Subject: 磁控濺鍍
    Subject: 擴散阻障層
    Subject: Ru-B
    Subject: Ta-B
    Subject: Ru-Ta-B
    Subject: magnetron sputtering
    Subject: diffusion barrier
    Online resource: http://cetd.lib.nfu.edu.tw/etdservice/view_metadata?etdun=U0028-2008201011534900
Items
  • 2 records • Pages 1 •
 
T002020 圖書館B1F 博碩士論文專區 不流通(NON_CIR) 碩士論文(TM) TM 008.152M 4004 99 一般使用(Normal) On shelf 0
T002021 圖書館B1F 可外借論文區 不流通(NON_CIR) 一般圖書 008.152M 4004 99 一般使用(Normal) On shelf 0
  • 2 records • Pages 1 •
Multimedia
Reviews
Export
pickup library
 
 
Change password
Login