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方昭訓

Overview
Works: 0 works in 20 publications in 1 languages
Titles
OCC熱模連續鑄造法研究與應用 = Research and Application of the OCC Heated Mold Continuous Casting Method by: Jau-Shiung Fang; 陳浚科; Chun-Ke Chen; 方昭訓 (Language materials, printed)
RFID應用於局限空間e化管理之研究 = Applications of rfid in confined space management system by: Eric-Wang; Jau-Shiung Fang; Hung-Wei Chen; 王鵬堯; 方昭訓; 陳泓瑋 (Language materials, printed)
銀鑭合金薄膜之抗氧化與抗硫化探討 = Study on against oxidation and sulfidation of ag(la) thin film by: 方昭訓; Yaun-Ting Chan; 詹媛婷; Jau-Shiung Fang (Language materials, printed)
Cu(CoN)與CoN薄膜應用於銅製程之特性研究 = Characteristics of Cu(CoN) Film and CoN Film on Copper Interconnection by: Jau-Shiung Fang; 方昭訓; 王梓育; Tzu-Yu Wang (Language materials, printed)
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Subjects
銀鑭合金薄膜 transparent conducting oxide 共濺鍍 稀磁半導體 Cu(Hf) alloy films 擴散阻障層 zinc oxide 低電阻率 reactive magnetron co-sputter co-sputtering Magnetron Sputter self-passivated 附著性 氮化鈷 cobalt nitrides 銅晶種層 HfN Ohno Continuous Casting Cu(Al) alloy thin film 碳 TaSi2 Cu(HEA)合金薄膜 錳 勞工 adhesion 非晶質薄膜 Cu(HEA) alloy thin film 鉭 high entropy alloy 鉭矽化物 穿隧磁阻 copper metallization amorphous plasma surface treatment 顆粒合金薄膜 heated mold thermal stability Cu(In) alloy thin film 基板偏壓 銅銦合金薄膜 非晶質 magnetron sputtering Cu(CoN) alloy thin film 銅 Ta-Co-N films Ta-B 磁控濺鍍 Carbon 熱模連續鑄造 labor Ta-Si-C(O)x copper 透明導電薄膜 sputtering deposition sulfidation Ta-Si-C 硫化 銅鋁合金薄膜 薄膜電晶體 高熵合金 銅鈷氮合金薄膜 Ru-Ta-B 銅製程 氧化銦 共濺鍍法 電漿表面改質 TaNi amorphous hin film tunneling magnetoresistance Ag(La) alloy thin film 自我鈍化 Cu electroplating 阻障層 銅金屬化製程 局限空間 銅鉿合金薄膜 amorphous films Cu(Hf) alloy thin film 合金薄膜 Thin-film transistor 加熱鑄模 diluted magnetic semiconductor 電鍍銅 反應性磁控濺鍍 Cu seed layer indium zinc oxide 氮化鉿 磁控共濺鍍 manganese 釕 RFID contract worker self-passivation substrate bias 熱穩定性 化學鍍浴沉積法 Ta-Si-C 薄膜 chemical bath deposition 無線射頻辨識技術 Ru-B Copper metallization 氧化鋅 承攬商 非晶質TaNi薄膜 Cu metallization confined space 濺鍍 擴散阻礙層 low resistivity co-sputter diffusion barrier magnetoresistance
 
 
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