Lau, John H.

Overview

Works:	39 works in 3 publications in 1 languages

Titles

Advanced MEMS packaging / by: Lau, John H. (Language materials, printed)

Advanced MEMS packaging by: Lau, John H. (Language materials, printed)

Fan-Out Wafer-Level Packaging by: Lau, John H.; SpringerLink (Online service) (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Assembly and Reliability of Lead-Free Solder Joints by: Lau, John H.; SpringerLink (Online service); Lee, Ning-Cheng. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

3D IC integration and packaging / by: Lau, John H. (Language materials, printed)

Semiconductor Advanced Packaging by: SpringerLink (Online service); Lau, John H. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Heterogeneous Integrations by: SpringerLink (Online service); Lau, John H. (Language materials, printed) , [http://id.loc.gov/vocabulary/relators/aut]

Fan-out wafer-level packaging by: SpringerLink (Online service); Lau, John H. (Language materials, printed)

Subjects

Nanotechnology and Microengineering. Electronics and Microelectronics, Instrumentation. Optical materials. Electronic circuits. Electronics. Chip scale packaging. Electronic Circuits and Devices. Semiconductors. Microelectronic packaging. Engineering. Production engineering. Industrial engineering. Microelectronics. Circuits and Systems. Nanotechnology. Optical and Electronic Materials. Three-dimensional integrated circuits. Industrial and Production Engineering. Electronic materials. Microelectromechanical systems.