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書目資訊
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Microelectronic packaging.
概要
作品:
19 作品在 9 項出版品 9 種語言
書目資訊
Advanced MEMS packaging
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Hot Cracking Phenomena in Welds
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Quantum-well laser array packaging : = nanoscale packaging techniques /
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Introduction to system-on-package (SOP) : = miniaturization of the entire system /
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Force Sensors for Microelectronic Packaging Applications
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Mems and microsystems : = design, manufacture, and packaging /
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Advanced MEMS packaging /
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(書目-語言資料,印刷品)
Fundamentals of microfabrication and nanotechnology /
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Advanced electronic packaging
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Advanced electronic packaging
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Bio and nano packaging techniques for electron devices = advances in electronic device packaging /
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Materials for advanced packaging
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Substrate integrated antennas and arrays /
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3D IC stacking technology /
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3D IC integration and packaging /
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MEMS packaging /
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更多
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Mise sous bo�itier (Micro�electronique)
Metallic Materials.
Material Science.
Microelectronics.
Wire bonding (Electronic packaging)
Lasers
Packaging
Electronics and Microelectronics, Instrumentation.
Microelectromechanical systems
Mise sous bo�itier (�Electronique)
Quantum wells.
Microstrip antennas.
Microelectronic packaging.
Nanostructured materials
Continuum Mechanics and Mechanics of Materials.
High power lasers.
Integrated circuits
Microfabrication.
Nanoscience.
Quality Control, Reliability, Safety and Risk.
Multichip modules (Microelectronics)
Chemistry.
Nanotechnology.
Characterization and Evaluation of Materials.
Machining.
Physics and Applied Physics in Engineering.
Optical and Electronic Materials.
Three-dimensional integrated circuits.
Materials Science.
Microelectromechanical systems.
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