Microelectronic packaging.

Overview

Works:	19 works in 9 publications in 9 languages

Titles

Advanced MEMS packaging by: (Language materials, printed)

Hot Cracking Phenomena in Welds by: (Language materials, printed)

Quantum-well laser array packaging : = nanoscale packaging techniques / by: (Language materials, printed)

Introduction to system-on-package (SOP) : = miniaturization of the entire system / by: (Language materials, printed)

Force Sensors for Microelectronic Packaging Applications by: (Language materials, printed)

Mems and microsystems : = design, manufacture, and packaging / by: (Language materials, printed)

Advanced MEMS packaging / by: (Language materials, printed)

Fundamentals of microfabrication and nanotechnology / by: (Language materials, printed)

Advanced electronic packaging by: (Language materials, printed)

Subjects

Lasers

Packaging