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書目資訊
主題
Microelectronic packaging.
概要
作品:
19 作品在 9 項出版品 9 種語言
書目資訊
Hot Cracking Phenomena in Welds
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Quantum-well laser array packaging : = nanoscale packaging techniques /
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Introduction to system-on-package (SOP) : = miniaturization of the entire system /
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Force Sensors for Microelectronic Packaging Applications
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Mems and microsystems : = design, manufacture, and packaging /
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Advanced MEMS packaging /
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Fundamentals of microfabrication and nanotechnology /
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Advanced electronic packaging
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Advanced electronic packaging
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Bio and nano packaging techniques for electron devices = advances in electronic device packaging /
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Materials for advanced packaging
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Substrate integrated antennas and arrays /
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3D IC stacking technology /
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(書目-語言資料,印刷品)
3D IC integration and packaging /
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MEMS packaging /
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Advanced MEMS packaging
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主題
Electronics and Microelectronics, Instrumentation.
Microelectromechanical systems
Mise sous bo�itier (Micro�electronique)
Microelectronics.
Integrated circuits
Mise sous bo�itier (�Electronique)
Microfabrication.
Nanoscience.
Quantum wells.
Quality Control, Reliability, Safety and Risk.
Wire bonding (Electronic packaging)
Multichip modules (Microelectronics)
Chemistry.
Nanotechnology.
Lasers
Characterization and Evaluation of Materials.
High power lasers.
Material Science.
Microstrip antennas.
Machining.
Physics and Applied Physics in Engineering.
Optical and Electronic Materials.
Microelectronic packaging.
Nanostructured materials
Three-dimensional integrated circuits.
Materials Science.
Packaging
Microelectromechanical systems.
Metallic Materials.
Continuum Mechanics and Mechanics of Materials.
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