Three-dimensional integrated circuits.
Overview
Works: | 11 works in 2 publications in 2 languages |
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Titles
TSV 3D RF integration : = high resistivity Si interposer technology /
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3D integration in VLSI circuits = implementation technologies and applications /
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Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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3D stacked chips = from emerging processes to heterogeneous systems /
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