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概要
書目資訊
主題
Three-dimensional integrated circuits.
概要
作品:
11 作品在 2 項出版品 2 種語言
書目資訊
TSV 3D RF integration : = high resistivity Si interposer technology /
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3D integration in VLSI circuits = implementation technologies and applications /
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Electrical modeling and design for 3D system integration = 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
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3D IC stacking technology /
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Vertical 3D memory technologies DUP_1
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Design and modeling for 3D ICs and interposers
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Vertical 3D memory technologies
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Advances in 3D integrated circuits and systems
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3D stacked chips = from emerging processes to heterogeneous systems /
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3D IC integration and packaging /
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主題
Electronic Circuits and Devices.
Microelectronic packaging.
Engineering.
Semiconductor storage devices.
Processor Architectures.
Integrated circuits
Circuits and Systems.
Silicon
Radio frequency integrated circuits.
Three-dimensional integrated circuits.
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