Languages
方昭訓
Overview
Works: | 0 works in 20 publications in 1 languages |
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Titles
OCC熱模連續鑄造法研究與應用 = Research and Application of the OCC Heated Mold Continuous Casting Method
by:
Jau-Shiung Fang; 陳浚科; Chun-Ke Chen; 方昭訓
(Language materials, printed)
共濺鍍沉積製備鈷-鈦-氧顆粒合金薄膜磁阻特性 = Evaluation of magnetoresistance characteristic of co-sputtered Co-Ti-O granular alloy thin films
by:
鄭文凱; Jau-Shiung Fang; 方昭訓
(Language materials, printed)
, [指導]
以金屬靶反應性磁控共濺鍍製備氧化銦鋅透明導電薄膜之研究 = Preparation and Properties of the Indium Zinc Oxide by Reactive Magnetron Co-sputtering using Indium and Zinc Metallic Targets
by:
Hui-Chin Chen; 方昭訓; 陳慧津; 國立虎尾科技大學; Jau-Shiung Fang
(Language materials, printed)
藍寶石基板之乾式蝕刻及其應用於氮化鎵發光二極體之研究 = Dry etching of sapphire substrates and its application for GaN-based light-emitting diodes
by:
武東星; Dong-Sing Wuu; 方昭訓; 施文忠; Jau-Shing Fang
(Language materials, printed)
, [指導]
RFID應用於局限空間e化管理之研究 = Applications of rfid in confined space management system
by:
Eric-Wang; Jau-Shiung Fang; Hung-Wei Chen; 王鵬堯; 方昭訓; 陳泓瑋
(Language materials, printed)
自我鈍化型銅鋁合金薄膜之抗氧化性及電性研究 = Improvement of Against Oxidation and Electrical Properties of Passivated Cu(Al) Thin Film
by:
方昭訓; 田宏吉; Jau-Shiung Fang; Hung-Chi Tien
(Language materials, printed)
銀鑭合金薄膜之抗氧化與抗硫化探討 = Study on against oxidation and sulfidation of ag(la) thin film
by:
方昭訓; Yaun-Ting Chan; 詹媛婷; Jau-Shiung Fang
(Language materials, printed)
雙層超薄Ru/Ta-Si-C擴散阻障層與銅連導線製程特性探討 = Properties of Ultrathin Ru/TaSiC Bi-Layer Diffusion Barrier for Cu Interconnects
by:
方昭訓; 黃孟碩; Meng-Shuo Huang; Jau-Shiung Fang
(Language materials, printed)
Cu(CoN)與CoN薄膜應用於銅製程之特性研究 = Characteristics of Cu(CoN) Film and CoN Film on Copper Interconnection
by:
Jau-Shiung Fang; 方昭訓; 王梓育; Tzu-Yu Wang
(Language materials, printed)
低電阻率自我鈍化型銅銦合金薄膜之固溶特性及電性研究 = Structural and passivate behaviors of Cu(In) thin film
by:
謝馨儀; 方昭訓; Jau-Shiung Fang
(Language materials, printed)
, [指導]
超薄Ta-Si-C 非晶質擴散阻障層銅製程特性探討 = Ultrathin ta-si-c amorphous films as a diffusion barrier for copper metallization
by:
邱敬富; Chin-Fu Chiu; Jau-Shiung Fang; 方昭訓
(Language materials, printed)
反應性濺鍍製備Ta-Co-N三元合金薄膜與銅金屬化製程整合特性探討 = Evaluation of Ternary Alloy TaCoN Thin Films Deposited by Reactive Sputtering for Copper Metallization
by:
Jau-Shiung Fang; 柯銘禮; 方昭訓
(Language materials, printed)
, [指導]
非晶質Ta-Ni薄膜製備與積體電路銅金屬化製程整合特性探討 = Evaluation of Ta-Ni amorphous thin film properties for copper metallization in integrated circuits
by:
方昭訓; 許藻錶; Jau-Shiung Fang
(Language materials, printed)
, [指導]
共濺鍍製備Cu1-xHfx薄膜擴散阻礙特性之研究 = Barrier properties of co-sputtering cu1-xhfx thin films
by:
Jau-Shiung Fang; Chih-Hsiang Huang; 黃智祥; 方昭訓
(Language materials, printed)
鐵鈷硼鈦鈮高熵合金薄膜應用於銅金屬化製程之探討 = Fe-Co-B-Ti-Nb High Entropy Thin Film for Copper Metallization
by:
Yi-Chiun Li; 楊立中; 李逸群; 方昭訓; Jau-Shiung Fang; Li-Chung Yang
(Language materials, printed)
化學鍍浴沉積法製備ZnO與ZnMnO透明導電氧化物薄膜之研究 = Preparation and properties of the zinc oxide and manganese-doped zinc oxide by chemical bath deposition
by:
駱煒翔; Wei-Hsiang Luo; 方昭訓; Jau-Shiung Fang.
(Language materials, printed)
5 nm之Ru-(Ta)-B擴散阻障層與銅製程特性 = 5 nm of Ru-(Ta)-B diffusion barrier layer and copper processing characteristics
by:
Jau-Shiun Fang; 方昭訓; 李文菁; Wen-Jing Li
(Language materials, printed)
鈷基合金薄膜之磁阻特性研究 = Study of magnetoresistance characteristic of cobalt-based thin films
by:
Ssu-Yu Lai; 方昭訓; 賴思宇; Jau-Shiung Fang; 國立虎尾科技大學
(Language materials, printed)
Ta-Si-C 非晶質擴散阻障應用於 銅製程之特性研究 = Characteristics of amorphous Ta-Si-C film as a diffusion barrier for copper metallization
by:
方昭訓; Jau-Shiung Fang; 蘇武加; Wu-Jia Su
(Language materials, printed)
自我鈍化型銅鉿合金薄膜之抗氧化性及電性研究 = Improvement of against oxidation and electrical properties of passivated cu(hf) thin film
by:
方昭訓; 陳佑慈; Yu-Tzu Chen; Jau-Shiung Fang
(Language materials, printed)
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Subjects
銀鑭合金薄膜
transparent conducting oxide
共濺鍍
稀磁半導體
Cu(Hf) alloy films
擴散阻障層
zinc oxide
低電阻率
reactive magnetron co-sputter
co-sputtering
Magnetron Sputter
self-passivated
附著性
氮化鈷
cobalt nitrides
銅晶種層
HfN
Ohno Continuous Casting
Cu(Al) alloy thin film
碳
TaSi2
Cu(HEA)合金薄膜
錳
勞工
adhesion
非晶質薄膜
Cu(HEA) alloy thin film
鉭
high entropy alloy
鉭矽化物
穿隧磁阻
copper metallization
amorphous
plasma surface treatment
顆粒合金薄膜
heated mold
thermal stability
Cu(In) alloy thin film
基板偏壓
銅銦合金薄膜
非晶質
magnetron sputtering
Cu(CoN) alloy thin film
銅
Ta-Co-N films
Ta-B
磁控濺鍍
Carbon
熱模連續鑄造
labor
Ta-Si-C(O)x
copper
透明導電薄膜
sputtering deposition
sulfidation
Ta-Si-C
硫化
銅鋁合金薄膜
薄膜電晶體
高熵合金
銅鈷氮合金薄膜
Ru-Ta-B
銅製程
氧化銦
共濺鍍法
電漿表面改質
TaNi amorphous hin film
tunneling magnetoresistance
Ag(La) alloy thin film
自我鈍化
Cu electroplating
阻障層
銅金屬化製程
局限空間
銅鉿合金薄膜
amorphous films
Cu(Hf) alloy thin film
合金薄膜
Thin-film transistor
加熱鑄模
diluted magnetic semiconductor
電鍍銅
反應性磁控濺鍍
Cu seed layer
indium zinc oxide
氮化鉿
磁控共濺鍍
manganese
釕
RFID
contract worker
self-passivation
substrate bias
熱穩定性
化學鍍浴沉積法
Ta-Si-C 薄膜
chemical bath deposition
無線射頻辨識技術
Ru-B
Copper metallization
氧化鋅
承攬商
非晶質TaNi薄膜
Cu metallization
confined space
濺鍍
擴散阻礙層
low resistivity
co-sputter
diffusion barrier
magnetoresistance